US Patent Issued to Micron Technology on July 14 for "Three-dimensional stacking semiconductor assemblies with near zero bond line thickness" (Idaho Inventor)

Posted On: 2026-07-14

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,233, issued on July 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Three-dimensional stacking semiconductor assemblies with ne... Read More

US Patent Issued to Samsung Display on July 14 for "Display device" (South Korean Inventors)

Posted On: 2026-07-14

Government News US Fed News Patentwipo

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,234, issued on July 14, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Seung Lyong Bok... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Fine pitch chip interconnect structure for bump bridge and high temperature storage improvement and methods for forming the same" (Taiwanese Inventors)

Posted On: 2026-07-14

Government News US Fed News Patentwipo

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,235, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Fine pitch chip interconnect struct... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Semiconductor device packages and methods of forming the same" (Taiwanese Inventors)

Posted On: 2026-07-14

Government News US Fed News Patentwipo

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,236, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device packages and m... Read More

US Patent Issued to DAIKIN INDUSTRIES on July 14 for "Power conversion device and refrigeration apparatus" (Japanese Inventors)

Posted On: 2026-07-14

Government News US Fed News Patentwipo

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,484, issued on July 14, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan). "Power conversion device and refrigeration apparatus" was in... Read More

US Patent Issued to Qorvo US on July 14 for "Ripple reduction for direct current-to-direct current (DC-DC) converters" (American, French Inventors)

Posted On: 2026-07-14

Government News US Fed News Patentwipo

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,485, issued on July 14, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Ripple reduction for direct current-to-direct current (DC-DC) co... Read More

US Patent Issued to DAIKIN INDUSTRIES on July 14 for "Method for controlling power converter" (Japanese Inventor)

Posted On: 2026-07-14

Government News US Fed News Patentwipo

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,486, issued on July 14, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan). "Method for controlling power converter" was invented by Ken... Read More

US Patent Issued to Huawei Digital Power Technologies on July 14 for "Power converter and detection method for terminal status" (Chinese Inventors)

Posted On: 2026-07-14

Government News US Fed News Patentwipo

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,487, issued on July 14, was assigned to Huawei Digital Power Technologies Co. Ltd. (Shenzhen, China). "Power converter and detection method... Read More

US Patent Issued to Huawei Digital Power Technologies on July 14 for "Inductor, power factor correction circuit, and power supply system" (Chinese, Swedish Inventors)

Posted On: 2026-07-14

Government News US Fed News Patentwipo

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,488, issued on July 14, was assigned to Huawei Digital Power Technologies Co. Ltd. (Shenzhen, China). "Inductor, power factor correction ci... Read More

US Patent Issued to HUAWEI DIGITAL POWER TECHNOLOGIES on July 14 for "Resonant switched capacitor converter and power supply system" (Chinese Inventors)

Posted On: 2026-07-14

Government News US Fed News Patentwipo

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,489, issued on July 14, was assigned to HUAWEI DIGITAL POWER TECHNOLOGIES Co. LTD. (Shenzhen, China). "Resonant switched capacitor converte... Read More

Exclusive

Category

Source

Publication

Byline

Location

US Patent Issued to Micron Technology on July 14 for "Three-dimensional stacking semiconductor assemblies with near zero bond line thickness" (Idaho Inventor)

US Patent Issued to Samsung Display on July 14 for "Display device" (South Korean Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Fine pitch chip interconnect structure for bump bridge and high temperature storage improvement and methods for forming the same" (Taiwanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Semiconductor device packages and methods of forming the same" (Taiwanese Inventors)

US Patent Issued to DAIKIN INDUSTRIES on July 14 for "Power conversion device and refrigeration apparatus" (Japanese Inventors)

US Patent Issued to Qorvo US on July 14 for "Ripple reduction for direct current-to-direct current (DC-DC) converters" (American, French Inventors)

US Patent Issued to DAIKIN INDUSTRIES on July 14 for "Method for controlling power converter" (Japanese Inventor)

US Patent Issued to Huawei Digital Power Technologies on July 14 for "Power converter and detection method for terminal status" (Chinese Inventors)

US Patent Issued to Huawei Digital Power Technologies on July 14 for "Inductor, power factor correction circuit, and power supply system" (Chinese, Swedish Inventors)

US Patent Issued to HUAWEI DIGITAL POWER TECHNOLOGIES on July 14 for "Resonant switched capacitor converter and power supply system" (Chinese Inventors)